| Features Qualcomm® Kryo™ 670 CPU Qualcomm Kryo Gold plus: high-performance core up to 2.7 GHz Qualcomm Kryo Gold: three high-performance cores at 2.4 GHz Qualcomm Kryo Silver: four low-power cores at 1.9 GHz Designed with the 6 nm process, for superior performance and power efficiency. 6th gen Qualcomm® AI Engine: A fused AI accelerator packing Qualcomm Hexagon Tensor Accelerator, Large shared AI memory, Hexagon Scalar Accelerator, and Hexagon Vector eXtensions (HVX) Qualcomm® Adreno 643 GPU at 812 MHz Qualcomm Adreno 633 VPU for high-quality, ultra HD video encode decode Dual-channel non-PoP high-speed memory, LPDDR5/LPDDR4x SDRAM LPDDR5 SDRAM designed for 3200 MHz clock (2 × 16 bit) LPDDR4X SDRAM designed for 2133 MHz clock (2 × 16 bit) Qualcomm® Universal Bandwidth Compression with camera, display, GPU, video, and compute DSP Display support: FHD+, 10 bit DisplayPort, eight hardware layers, improved HDR10+, and wide color Gamut, Qualcomm® Low-Power Picture Enhancement display feature, and Qualcomm® True Palette Display feature One 4-lane DSI DSC1.2, D-PHY 1.2, or C-PHY 1.0; VESA DSC 1.2 Triple 14-bit image signal processing (ISP) + two lite ISP 22 + 22 + 22 MP, 64 MP/30 fps Five 4-lane CSIs (4/4/4/4/4) D-PHY 1.2 or C-PHY 1.2 Support for USB 3.1 Type-C with DisplayPort and USB 2.0 Long term support for Android OS upgrades, Linux, Ubuntu, Windows 11 IoT Enterprise, security updates and enterprise grade hardware. | Specifications | ||
| Qualcomm® Artificial Intelligence (AI) Engine | |||
| GPU Name: Qualcomm® Adreno™ 643L | |||
| CPU Name: Qualcomm® Kryo™ 670 | |||
| Qualcomm® Hexagon™ Processor Name: Qualcomm® Hexagon™ 770 | |||
| Qualcomm® Hexagon™ Processor Features: Qualcomm® Hexagon™ Tensor Accelerator, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Qualcomm® Hexagon™ Voice Assistant Accelerator, Large shared AI memory | |||
| Qualcomm® Sensing Hub Generation: 2nd | |||
| Qualcomm® Sensing Hub Features: Qualcomm® Sensing Hub | |||
| Tera Operations Per Second (TOPS): 12 TOPS | |||
| CPU | |||
| Name: Qualcomm® Kryo™ 670, 4x Arm® Cortex®-A55 Processor, 4x Arm® Cortex®-A78 Processor | |||
| Number of Cores: 8 | |||
| Architecture: 64-bit | |||
| Clock Speed: Up to 2.4 GHz | |||
| GPU | |||
| Name: Qualcomm® Adreno™ 643L | |||
| Clock Speed: Up to 812 MHz | |||
| APIs: OpenGL® ES 3.2, DirectX® FL 12, OpenCL™ 2.0 FP, Vulkan® 1.1 | |||
| DSP | |||
| Name: Qualcomm® Hexagon™ | |||
| Location | |||
| Location Support: Sensor-assisted Positioning | |||
| Satellite Systems: GLONASS, NavIC, QZSS, Galileo, Beidou, SBAS, GPS | |||
| Frequency Support: Dual (L1/L5) | |||
| Accuracy: Lane-level, Sidewalk-level | |||
| Features: Global Freeway Vehicle Navigation | |||
| Cellular Modem-RF | |||
| Cellular Modem-RF Specs: 400 MHz bandwidth (mmWave), 100 MHz bandwidth (sub-6 GHz) | |||
| Cellular Technology: 5G NR, LTE support for CBRS, HSPA, sub-6 GHz1, Dynamic Spectrum Sharing (DSS), LTE, GSM/EDGE, CDMA 1x, EV-DO, WCDMA, mmWave | |||
| Wi-Fi | |||
| Wi-Fi/Bluetooth System: Qualcomm® FastConnect™ 69002, Qualcomm® FastConnect™ 67003 | |||
| Peak Speed: 3.6 Gbps | |||
| Generation: Wi-Fi 6E | |||
| Standards: 802.11b, 802.11g, 802.11n, 802.11ax, 802.11ac | |||
| Spectral Bands: 2.4 GHz, 6 GHz, 5 GHz | |||
| Channels: 160 MHz, 80 MHz, 40 MHz, 20 MHz | |||
| MIMO Configuration: 2x2 | |||
| Peak QAM: 4K QAM | |||
| Security: WPA3 | |||
| Features: MU-MIMO (UL/DL), Dual-Band Simultaneous (DBS)2, OFDMA | |||
| NFC | |||
| Near Field Communications: Supported | |||
| Bluetooth | |||
| Wi-Fi/Bluetooth System: Qualcomm® FastConnect™ 67003, Qualcomm® FastConnect™ 69002 | |||
| Specification Version: Bluetooth® 5.2 | |||
| Topologies: Dual Bluetooth® Radios | |||
| Low Energy Features: Bluetooth® Low Energy Audio | |||
| Camera | |||
| Inputs: 5 cameras | |||
| Image Signal Processor (ISP) Name: Qualcomm® Spectra™ 570L | |||
| Image Signal Processor (ISP) Type: Image Signal Processor (ISP) | |||
| Image Signal Processor (ISP) Number: Triple ISP | |||
| Image Signal Processor (ISP) Bit Depth: 14-bit | |||
| Triple Camera: 22+22+22 MP4 | |||
| Dual Camera: Up to 36+22 MP4 | |||
| Single Camera (MFNR, ZSL, 30 fps): 108 MP | |||
| Single Camera (ZSL, 30 fps): 64 MP | |||
| Features: Mega Low light photography | |||
| Video Capture: 8K @ 30 fps, 4K @ 120 fps | |||
| Slow Motion Video Capture: 720p @ 960 fps | |||
| Video Capture Formats: Dolby Vision®, HDR10, HDR10+ | |||
| Video Capture Features: Engine for Visual Analytics 3.0 | |||
| Single Camera: Up to 192 MP, Up to 64 MP5 | |||
| Video Playback | |||
| Resolution: 8K @ 60 fps | |||
| Codecs: HDR10, HDR10+ | |||
| Features: HDR Vivid | |||
| Display | |||
| Display Processing Unit (DPU) Name: Qualcomm® Adreno™ 1075 | |||
| Number of Concurrent Displays: 2 | |||
| Maximum On-Device Display Resolution: QHD+ @ 144 Hz | |||
| Maximum External Display Resolution: 4K @ 60 Hz | |||
| High Dynamic Range (HDR): HDR10+, HDR10 | |||
| Color Depth: Up to 10-bit6 | |||
| Color Gamut: Rec. 2020 | |||
| Interface Type: USB-C with DisplayPort, USB 2.0, 2x PCIe, USB 3.1 | |||
| Audio | |||
| Qualcomm Aqstic™ technology support: Qualcomm Aqstic™ smart speaker amplifier | |||
| Qualcomm® aptX™ audio technology support: Qualcomm® aptX™ Voice | |||
| Interfaces | |||
| Supported Interfaces: USB-C with DisplayPort, USB 2.0, USB 3.1, 2x PCIe | |||
| Universal Serial Bus (USB) | |||
| Interface Type: USB-C with DisplayPort | |||
| Specification Version: USB 3.1, USB 2.0 | |||
| PCIe | |||
| Number of Interfaces: 2 | |||
| Security | |||
| Fingerprint Sensor: Qualcomm® 3D Sonic Sensor Max | |||
| Secure Processing Unit (SPU): Biometric Authentication (Face) | |||
| Features: Qualcomm® Wireless Edge Services (WES) | |||
| Charging | |||
| Qualcomm® Quick Charge™ technology support: Qualcomm® Quick Charge™ 5 technology | |||
| Software Options | |||
| Operating System: Android, Windows, Linux, Ubuntu | |||
| Development Software | |||
| Development Artificial Intelligence (AI): Qualcomm® AI Stack | |||
| Memory | |||
| Speed: 4200 MHz | |||
| Type: LPDDR5x | |||
| Storage | |||
| eMMC: eMMC 5.1 | |||
| SD: SD 3.0 | |||
| UFS: UFS 3.1 | |||
| Process Node and Technology | |||
| Process Node: 6 nm | |||
| Part | |||
| Part Number(s): QCM6490 |